Co-Packaged Optics (CPO) is driving innovation in advanced semiconductor packaging, essential for next-gen electronics and AI-driven data growth. Key opportunities lie in leveraging patents to ...
PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...
OIF and 40 participating member companies will use OFC 2026, March 17--19, to validate the interoperable building blocks AI-era data center networks increasingly depend on -- demonstrating, live and ...
SAN FRANCISCO--(BUSINESS WIRE)--Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle™ interconnect platform at OFC 2025 in San ...
In data centers today, there is a constant need for speed. And it's not only inside computer data servers, where one might think it would be. Computing power, capacity, and speed has been increasing ...
New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects. Developing a roadmap with partners across ...
According to a recently published report from Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the Optical ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global ...
Ayar Labs Inc., a startup that’s developing optical interconnects that can transmit data between computer chips via light, said today it has closed on a hefty late-stage $155 million funding round led ...
According to a recently published report from Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the Optical ...
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