ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of a jv between Softbank, Tokyo University and Intel called Saimemory ...

Detailed price information for Koninklijke Philips Electronics ADR (PHG-N) from The Globe and Mail including charting and trades.

“Existing memory designs fail to meet the demands of artificial intelligence (AI). We aim to present a completely new approach that will accelerate AI technology development over the next decade.” ...

TL;DR: Intel and SoftBank unveiled next-generation ZAM memory prototypes featuring a unique Z-angle interconnect architecture that improves thermal management and reduces power consumption by 40-50%.

As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM capacity remains concentrated among Samsung, SK Hynix, and Micron. Save my ...

Intel is collaborating with Saimemory to develop Z-Angle Memory (ZAM), a new DRAM technology that stacks RAM vertically to increase memory density. PCWorld reports that prototypes are expected by 2027 ...

Intel Corp. announced a collaboration with SoftBank Corp. subsidiary SAIMEMORY to develop a memory technology called the Z-Angle Memory (ZAM) program. The collaboration focuses on next generation ...

TL;DR: Intel partners with SoftBank's SAIMEMORY to advance next-generation DRAM bonding technology using Z-Angle Memory (ZAM), enabling higher capacity, lower power consumption, and improved ...

Zam Plante, Max Plante, and Ty Hanson all landed on the initial list of nominees for the Hobey Baker Award, given annually to the top Division I men’s hockey player in the country. Max Plante leads ...

There is uncertainty about what is next for local businesses and their customers after the Supreme Court struck down President Trump's sweeping tariffs. Great news! Low snowpack does not necessarily ...