ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of a jv between Softbank, Tokyo University and Intel called Saimemory ...
The Chosun Ilbo on MSN
US.-Japan ZAM challenges Korea's HBM dominance
Existing memory designs are failing to meet the demands of artificial intelligence (AI). We aim to present a completely new approach that will accelerate AI technology development over the next decade ...
The Chosun Ilbo on MSN
US.-Japan ZAM challenges South Korea's HBM dominance
Existing memory designs are failing to meet the demands of artificial intelligence (AI). We aim to present a completely new approach that will accelerate AI technology development over the next 10 ...
TL;DR: Intel and SoftBank unveiled next-generation ZAM memory prototypes featuring a unique Z-angle interconnect architecture that improves thermal management and reduces power consumption by 40-50%.
TL;DR: Intel partners with SoftBank's SAIMEMORY to advance next-generation DRAM bonding technology using Z-Angle Memory (ZAM), enabling higher capacity, lower power consumption, and improved ...
Health experts warn no single type of product can treat all kinds of eye diseases, refuting false social media advertisements ...
DULUTH — Sophomore center Zam Plante snapped Minnesota Duluth’s four-game losing streak, scoring with 6.2 seconds left in overtime to give the No. 10 Bulldogs a 3-2 victory over No. 3 North Dakota in ...
Intel Corp. announced a collaboration with SoftBank Corp. subsidiary SAIMEMORY to develop a memory technology called the Z-Angle Memory (ZAM) program. The collaboration focuses on next generation ...
A SoftBank subsidiary has signed a collaboration agreement with Intel to commercialize "next-generation memory technology." ...
Intel is collaborating with Saimemory to develop Z-Angle Memory (ZAM), a new DRAM technology that stacks RAM vertically to increase memory density. PCWorld reports that prototypes are expected by 2027 ...
As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM capacity remains concentrated among Samsung, SK Hynix, and Micron. Save my ...
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